PLANT AND EQUIPMENT
PLANT AND EQUIPMENT
Wafer Sawing
Die Bonding
Wire Bonding
Molding
Testing
Packing
ZOCA Semiconductor and Technology (Dongguan) Co., Ltd
Shenzhen Operation Center
Address：Room 1809, Building 4, Tangwei Business Building, Fuyong Fuhai Street, Bao'an District, Shenzhen, China
